Datasheets


N° of component 

TDK Ultra-Compact Bluetooth Smart Module

May 19, 2015 - Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, is now stocking the SESUB-PAN-T2541 Bluetooth® v4.0 Module from TDK. This ultra-compact, Bluetooth® 4.0 Low Energy (LE) micro module is one of the world's smallest modules for Bluetooth Smart® devices. The SESUB-PAN-T2541 is based on TDK's proprietary Semiconductor Embedded in Substrate (SESUB) technology, resulting in a size much smaller than modules using discrete components. Power consumption is about 25 percent less than classic Bluetooth devices. The module offers easy implementation of Bluetooth connectivity by simply connecting a power supply, microcontroller interface, and antenna.

The TDK SESUB-PAN-T2541 Bluetooth v4.0 Module, available from Mouser Electronics, features TDK's proprietary SESUB technology. A Texas Instruments CC2541 Bluetooth SoC die is mounted onto a thin substrate, along with all peripheral circuitry including a 32MHz crystal, bandpass filter, and capacitors. This results in a module about 65 percent smaller most competitive solutions. All I/Os from the substrate layers are also routed to a ball grid array (BGA) footprint on the module's bottom surface. Interfaces include UART, SPI, I2C, and I/O. All this functionality helps to speed the hardware design process, allowing fast and easy implementation of Bluetooth connectivity. Output power is rated at 0 dBm (typ.), with a communication range of 10 meters, depending on line of sight and antenna characteristics.

The TDK SESUB-PAN-T2541 Bluetooth v4.0 Module targets low-powerwireless applications, including consumer applications as well as wireless sensors, cable replacement applications, instrumentationheart rate monitors, and blood glucose meters. Other applications include Internet of Things and Wearable devices.

The SESUB-PAN-T2541 Bluetooth v4.0 Module is available now through Mouser Electronics in an ultra-compact, 4.6 mm x 5.6 mm x 1.0 mm footprint, with a slim insertion height of just 1 mm.

To learn more, visit http://www.mouser.com/new/tdk/tdk-sesub-pan-t2541/ .

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